페이지 20 - Xilinx Inc. 제품 - 내장형 - 단일 칩 시스템(SoC) | Heisener Electronics
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Xilinx Inc. 제품 - 내장형 - 단일 칩 시스템(SoC)

기록 533
페이지  20/20
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제조업체
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패키지
재고
수량
Core Processor
Flash Size
RAM Size
Peripherals
Connectivity
Speed
Primary Attributes
Operating Temperature
Package / Case
Supplier Device Package
XQ7Z020-1CL484I4332
Xilinx Inc.

IC FPGA QPRO 484BGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 667MHz
  • Primary Attributes: Artix?-7 FPGA, 85K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-LFBGA, CSPBGA
  • Supplier Device Package: 484-CSPBGA (19x19)
패키지: 484-LFBGA, CSPBGA
재고7,120
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
256KB
DMA
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
667MHz
Artix?-7 FPGA, 85K Logic Cells
-40°C ~ 100°C (TJ)
484-LFBGA, CSPBGA
484-CSPBGA (19x19)