Using the new chip technology, Infineon Technologies currently offers the new TRENCHSTOP 1700V IGBT7 chip in the standard industrial package EconoDUAL 3. The device provides 900A and 75A leading current and allows to improve the power range of the inverter. These modules target a wide range of applications including wind, drive and SVG.
Compared with past IGBT4 chipset modules, the FF900R17ME7_B11 with this chip can achieve up to 40% higher inverter output current in the same package size. The new module also offers significantly lower static and dynamic losses while addressing applications with static losses prevalent in diode chips.
In addition, the new chip technology provides enhanced du/dt controllability and enhanced diode flexibility. The fitrate is also greatly improved under cosmic ray induction, an important parameter when operating at high DC link voltages. In addition, the maximum overload junction temperature of the new power modules can reach 175C.
In addition to the best-in-class 1700V EconoDUAL 3 with 900A, a 750A module with larger diodes has also been released, further increasing the flexibility of new combinations. Overall, the new module featuring the TRENCHSTOP IGBT 7 chip can increase the power density of the inverter and reach a new level of performance in a wide range of applications.
