페이지 232 - Xilinx Inc. 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
XC17V08PC44C	Xilinx Inc.	IC PROM SER C-TEMP 3.3V 44-PLCC Programmable Type: OTP Memory Size: 8Mb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: 0°C ~ 70°C Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	패키지: 44-LCC (J-Lead)	재고2,208
XC17S30XLPD8I	Xilinx Inc.	IC PROM PROG I-TEMP 3.3V 8-DIP Programmable Type: OTP Memory Size: 300kb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP	패키지: 8-DIP (0.300", 7.62mm)	재고5,744
XCZU7EG-3FBVB900E	Xilinx Inc.	IC FPGA 204 I/O 900FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	패키지: 900-BBGA, FCBGA	재고6,576
XC7Z045-2FF900E	Xilinx Inc.	IC SOC CORTEX-A9 KINTEX7 900BGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex?-7 FPGA, 350K Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	패키지: 900-BBGA, FCBGA	재고5,024
XC7Z030-1FBG676C	Xilinx Inc.	IC SOC CORTEX-A9 KINTEX7 676FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	패키지: 676-BBGA, FCBGA	재고6,240
XCV1600E-7FG900C	Xilinx Inc.	IC FPGA 700 I/O 900FBGA Number of LABs/CLBs: 7776 Number of Logic Elements/Cells: 34992 Total RAM Bits: 589824 Number of I/O: 700 Number of Gates: 2188742 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 900-BBGA Supplier Device Package: 900-FBGA (31x31)	패키지: 900-BBGA	재고6,096
XCV150-5BG352I	Xilinx Inc.	IC FPGA 260 I/O 352MBGA Number of LABs/CLBs: 864 Number of Logic Elements/Cells: 3888 Total RAM Bits: 49152 Number of I/O: 260 Number of Gates: 164674 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 352-LBGA, Metal Supplier Device Package: 352-MBGA (35x35)	패키지: 352-LBGA, Metal	재고3,968
XC4052XL-2BG432I	Xilinx Inc.	IC FPGA 352 I/O 432MBGA Number of LABs/CLBs: 1936 Number of Logic Elements/Cells: 4598 Total RAM Bits: 61952 Number of I/O: 352 Number of Gates: 52000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	패키지: 432-LBGA, Metal	재고4,560
XC4013E-3BG225I	Xilinx Inc.	IC FPGA 192 I/O 225BGA Number of LABs/CLBs: 576 Number of Logic Elements/Cells: 1368 Total RAM Bits: 18432 Number of I/O: 192 Number of Gates: 13000 Voltage - Supply: 4.5 V ~ 5.5 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 225-BBGA Supplier Device Package: 225-PBGA (27x27)	패키지: 225-BBGA	재고6,752
XC4005XL-2PQ160I	Xilinx Inc.	IC FPGA 112 I/O 160QFP Number of LABs/CLBs: 196 Number of Logic Elements/Cells: 466 Total RAM Bits: 6272 Number of I/O: 112 Number of Gates: 5000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 160-BQFP Supplier Device Package: 160-PQFP (28x28)	패키지: 160-BQFP	재고5,200
XC2S30-5PQ208C	Xilinx Inc.	IC FPGA 140 I/O 208QFP Number of LABs/CLBs: 216 Number of Logic Elements/Cells: 972 Total RAM Bits: 24576 Number of I/O: 140 Number of Gates: 30000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	패키지: 208-BFQFP	재고3,648
XC7VX485T-1FFG1761I	Xilinx Inc.	IC FPGA 700 I/O 1761FCBGA Number of LABs/CLBs: 37950 Number of Logic Elements/Cells: 485760 Total RAM Bits: 37969920 Number of I/O: 700 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1761-FCBGA (42.5x42.5)	패키지: 1760-BBGA, FCBGA	재고5,296
XC5VLX220T-1FFG1738C	Xilinx Inc.	IC FPGA 680 I/O 1738FCBGA Number of LABs/CLBs: 17280 Number of Logic Elements/Cells: 221184 Total RAM Bits: 7815168 Number of I/O: 680 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1738-BBGA, FCBGA Supplier Device Package: 1738-FCBGA (42.5x42.5)	패키지: 1738-BBGA, FCBGA	재고5,504
XQ5VLX220T-DIE4058	Xilinx Inc.	IC FPGA VIRTEX-5 220K DIE Number of LABs/CLBs: 17280 Number of Logic Elements/Cells: 221184 Total RAM Bits: 7815168 Number of I/O: - Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: - Package / Case: Die Supplier Device Package: Die	패키지: Die	재고5,264
XC2VP30-6FF896C	Xilinx Inc.	IC FPGA 556 I/O 896FCBGA Number of LABs/CLBs: 3424 Number of Logic Elements/Cells: 30816 Total RAM Bits: 2506752 Number of I/O: 556 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FCBGA (31x31)	패키지: 896-BBGA, FCBGA	재고5,600
XC5VLX50T-1FF1136I	Xilinx Inc.	IC FPGA 480 I/O 1136FCBGA Number of LABs/CLBs: 3600 Number of Logic Elements/Cells: 46080 Total RAM Bits: 2211840 Number of I/O: 480 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1136-BBGA, FCBGA Supplier Device Package: 1136-FCBGA (35x35)	패키지: 1136-BBGA, FCBGA	재고15,312
XC6VLX130T-2FFG484C	Xilinx Inc.	IC FPGA 240 I/O 484FCBGA Number of LABs/CLBs: 10000 Number of Logic Elements/Cells: 128000 Total RAM Bits: 9732096 Number of I/O: 240 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	패키지: 484-BBGA	재고15,000
XC6VCX130T-1FF1156C	Xilinx Inc.	IC FPGA 600 I/O 1156FCBGA Number of LABs/CLBs: 10000 Number of Logic Elements/Cells: 128000 Total RAM Bits: 9732096 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	패키지: 1156-BBGA, FCBGA	재고5,952
XC4VLX40-10FFG668I	Xilinx Inc.	IC FPGA 448 I/O 668FCBGA Number of LABs/CLBs: 4608 Number of Logic Elements/Cells: 41472 Total RAM Bits: 1769472 Number of I/O: 448 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 668-BBGA, FCBGA Supplier Device Package: 668-FCBGA (27x27)	패키지: 668-BBGA, FCBGA	재고3,856
XC5VLX30T-1FF665C	Xilinx Inc.	IC FPGA 360 I/O 665FCBGA Number of LABs/CLBs: 2400 Number of Logic Elements/Cells: 30720 Total RAM Bits: 1327104 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 665-BBGA, FCBGA Supplier Device Package: 665-FCBGA (27x27)	패키지: 665-BBGA, FCBGA	재고3,600
XQ6SLX150-2FG484Q	Xilinx Inc.	IC FPGA SPARTAN 6 147K 484BGA Number of LABs/CLBs: 11519 Number of Logic Elements/Cells: 147443 Total RAM Bits: 4939776 Number of I/O: 338 Number of Gates: - Voltage - Supply: 1.2 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	패키지: 484-BBGA	재고6,336
XC6SLX150T-3FG484C	Xilinx Inc.	IC FPGA 296 I/O 484FBGA Number of LABs/CLBs: 11519 Number of Logic Elements/Cells: 147443 Total RAM Bits: 4939776 Number of I/O: 296 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	패키지: 484-BBGA	재고4,064
XC7A35T-2CS324I	Xilinx Inc.	XC7A35T-2CS324I Number of LABs/CLBs: 2600 Number of Logic Elements/Cells: 33208 Total RAM Bits: 1843200 Number of I/O: 210 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 324-LFBGA, CSPBGA Supplier Device Package: 324-CSPBGA (15x15)	패키지: 324-LFBGA, CSPBGA	재고6,032
XC6SLX25-3FT256I	Xilinx Inc.	IC FPGA 186 I/O 256FTBGA Number of LABs/CLBs: 1879 Number of Logic Elements/Cells: 24051 Total RAM Bits: 958464 Number of I/O: 186 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	패키지: 256-LBGA	재고7,360
XC3S100E-4TQ144C	Xilinx Inc.	IC FPGA 108 I/O 144TQFP Number of LABs/CLBs: 240 Number of Logic Elements/Cells: 2160 Total RAM Bits: 73728 Number of I/O: 108 Number of Gates: 100000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	패키지: 144-LQFP	재고11,400
XC4003-6PQ100C	Xilinx Inc.	IC FPGA 77 I/O 100QFP Number of LABs/CLBs: 100 Number of Logic Elements/Cells: 238 Total RAM Bits: 3200 Number of I/O: 77 Number of Gates: 3000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 100-BQFP Supplier Device Package: 100-PQFP (14x20)	패키지: 100-BQFP	재고5,216
XC95288XL-10BG256C	Xilinx Inc.	IC CPLD 288MC 10NS 256BGA Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 288 Number of Gates: 6400 Number of I/O: 192 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (27x27)	패키지: 256-BBGA	재고9,540
XCVU440-2FLGB2377I	Xilinx Inc.	IC FPGA 1248 I/O 2377BGA Number of LABs/CLBs: 316620 Number of Logic Elements/Cells: 5540850 Total RAM Bits: 90726400 Number of I/O: 1300 Number of Gates: - Voltage - Supply: 0.922 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2377-BBGA, FCBGA Supplier Device Package: 2377-FCBGA (50x50)	패키지: 2377-BBGA, FCBGA	재고4,000

XC17V08PC44C

Xilinx Inc.

IC PROM SER C-TEMP 3.3V 44-PLCC

Programmable Type: OTP
Memory Size: 8Mb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 44-LCC (J-Lead)
Supplier Device Package: 44-PLCC (16.59x16.59)

패키지: 44-LCC (J-Lead)

재고2,208

XC17S30XLPD8I

Xilinx Inc.

IC PROM PROG I-TEMP 3.3V 8-DIP

Programmable Type: OTP
Memory Size: 300kb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-PDIP

패키지: 8-DIP (0.300", 7.62mm)

재고5,744

XCZU7EG-3FBVB900E

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

패키지: 900-BBGA, FCBGA

재고6,576

XC7Z045-2FF900E

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 900BGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: Kintex?-7 FPGA, 350K Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

패키지: 900-BBGA, FCBGA

재고5,024

XC7Z030-1FBG676C

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 667MHz
Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

패키지: 676-BBGA, FCBGA

재고6,240

XCV1600E-7FG900C

Xilinx Inc.

IC FPGA 700 I/O 900FBGA

Number of LABs/CLBs: 7776
Number of Logic Elements/Cells: 34992
Total RAM Bits: 589824
Number of I/O: 700
Number of Gates: 2188742
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 900-BBGA
Supplier Device Package: 900-FBGA (31x31)

패키지: 900-BBGA

재고6,096

XCV150-5BG352I

Xilinx Inc.

IC FPGA 260 I/O 352MBGA

Number of LABs/CLBs: 864
Number of Logic Elements/Cells: 3888
Total RAM Bits: 49152
Number of I/O: 260
Number of Gates: 164674
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 352-LBGA, Metal
Supplier Device Package: 352-MBGA (35x35)

패키지: 352-LBGA, Metal

재고3,968

XC4052XL-2BG432I

Xilinx Inc.

IC FPGA 352 I/O 432MBGA

Number of LABs/CLBs: 1936
Number of Logic Elements/Cells: 4598
Total RAM Bits: 61952
Number of I/O: 352
Number of Gates: 52000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 432-LBGA, Metal
Supplier Device Package: 432-MBGA (40x40)

패키지: 432-LBGA, Metal

재고4,560

XC4013E-3BG225I

Xilinx Inc.

IC FPGA 192 I/O 225BGA

Number of LABs/CLBs: 576
Number of Logic Elements/Cells: 1368
Total RAM Bits: 18432
Number of I/O: 192
Number of Gates: 13000
Voltage - Supply: 4.5 V ~ 5.5 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 225-BBGA
Supplier Device Package: 225-PBGA (27x27)

패키지: 225-BBGA

재고6,752

XC4005XL-2PQ160I

Xilinx Inc.

IC FPGA 112 I/O 160QFP

Number of LABs/CLBs: 196
Number of Logic Elements/Cells: 466
Total RAM Bits: 6272
Number of I/O: 112
Number of Gates: 5000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 160-BQFP
Supplier Device Package: 160-PQFP (28x28)

패키지: 160-BQFP

재고5,200

XC2S30-5PQ208C

Xilinx Inc.

IC FPGA 140 I/O 208QFP

Number of LABs/CLBs: 216
Number of Logic Elements/Cells: 972
Total RAM Bits: 24576
Number of I/O: 140
Number of Gates: 30000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

패키지: 208-BFQFP

재고3,648

XC7VX485T-1FFG1761I

Xilinx Inc.

IC FPGA 700 I/O 1761FCBGA

Number of LABs/CLBs: 37950
Number of Logic Elements/Cells: 485760
Total RAM Bits: 37969920
Number of I/O: 700
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1761-FCBGA (42.5x42.5)

패키지: 1760-BBGA, FCBGA

재고5,296

XC5VLX220T-1FFG1738C

Xilinx Inc.

IC FPGA 680 I/O 1738FCBGA

Number of LABs/CLBs: 17280
Number of Logic Elements/Cells: 221184
Total RAM Bits: 7815168
Number of I/O: 680
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1738-BBGA, FCBGA
Supplier Device Package: 1738-FCBGA (42.5x42.5)

패키지: 1738-BBGA, FCBGA

재고5,504

XQ5VLX220T-DIE4058

Xilinx Inc.

IC FPGA VIRTEX-5 220K DIE

Number of LABs/CLBs: 17280
Number of Logic Elements/Cells: 221184
Total RAM Bits: 7815168
Number of I/O: -
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -
Package / Case: Die
Supplier Device Package: Die

패키지: Die

재고5,264

XC2VP30-6FF896C

Xilinx Inc.

IC FPGA 556 I/O 896FCBGA

Number of LABs/CLBs: 3424
Number of Logic Elements/Cells: 30816
Total RAM Bits: 2506752
Number of I/O: 556
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BBGA, FCBGA
Supplier Device Package: 896-FCBGA (31x31)

패키지: 896-BBGA, FCBGA

재고5,600

XC5VLX50T-1FF1136I

Xilinx Inc.

IC FPGA 480 I/O 1136FCBGA

Number of LABs/CLBs: 3600
Number of Logic Elements/Cells: 46080
Total RAM Bits: 2211840
Number of I/O: 480
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1136-BBGA, FCBGA
Supplier Device Package: 1136-FCBGA (35x35)

패키지: 1136-BBGA, FCBGA

재고15,312

XC6VLX130T-2FFG484C

Xilinx Inc.

IC FPGA 240 I/O 484FCBGA

Number of LABs/CLBs: 10000
Number of Logic Elements/Cells: 128000
Total RAM Bits: 9732096
Number of I/O: 240
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

패키지: 484-BBGA

재고15,000

XC6VCX130T-1FF1156C

Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

Number of LABs/CLBs: 10000
Number of Logic Elements/Cells: 128000
Total RAM Bits: 9732096
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

패키지: 1156-BBGA, FCBGA

재고5,952

XC4VLX40-10FFG668I

Xilinx Inc.

IC FPGA 448 I/O 668FCBGA

Number of LABs/CLBs: 4608
Number of Logic Elements/Cells: 41472
Total RAM Bits: 1769472
Number of I/O: 448
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 668-BBGA, FCBGA
Supplier Device Package: 668-FCBGA (27x27)

패키지: 668-BBGA, FCBGA

재고3,856

XC5VLX30T-1FF665C

Xilinx Inc.

IC FPGA 360 I/O 665FCBGA

Number of LABs/CLBs: 2400
Number of Logic Elements/Cells: 30720
Total RAM Bits: 1327104
Number of I/O: 360
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 665-BBGA, FCBGA
Supplier Device Package: 665-FCBGA (27x27)

패키지: 665-BBGA, FCBGA

재고3,600

XQ6SLX150-2FG484Q

Xilinx Inc.

IC FPGA SPARTAN 6 147K 484BGA

Number of LABs/CLBs: 11519
Number of Logic Elements/Cells: 147443
Total RAM Bits: 4939776
Number of I/O: 338
Number of Gates: -
Voltage - Supply: 1.2 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

패키지: 484-BBGA

재고6,336

XC6SLX150T-3FG484C

Xilinx Inc.

IC FPGA 296 I/O 484FBGA

Number of LABs/CLBs: 11519
Number of Logic Elements/Cells: 147443
Total RAM Bits: 4939776
Number of I/O: 296
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

패키지: 484-BBGA

재고4,064

XC7A35T-2CS324I

Xilinx Inc.

XC7A35T-2CS324I

Number of LABs/CLBs: 2600
Number of Logic Elements/Cells: 33208
Total RAM Bits: 1843200
Number of I/O: 210
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 324-LFBGA, CSPBGA
Supplier Device Package: 324-CSPBGA (15x15)

패키지: 324-LFBGA, CSPBGA

재고6,032

XC6SLX25-3FT256I

Xilinx Inc.

IC FPGA 186 I/O 256FTBGA

Number of LABs/CLBs: 1879
Number of Logic Elements/Cells: 24051
Total RAM Bits: 958464
Number of I/O: 186
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FTBGA (17x17)

패키지: 256-LBGA

재고7,360

XC3S100E-4TQ144C

Xilinx Inc.

IC FPGA 108 I/O 144TQFP

Number of LABs/CLBs: 240
Number of Logic Elements/Cells: 2160
Total RAM Bits: 73728
Number of I/O: 108
Number of Gates: 100000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

패키지: 144-LQFP

재고11,400

XC4003-6PQ100C

Xilinx Inc.

IC FPGA 77 I/O 100QFP

Number of LABs/CLBs: 100
Number of Logic Elements/Cells: 238
Total RAM Bits: 3200
Number of I/O: 77
Number of Gates: 3000
Voltage - Supply: 4.75 V ~ 5.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 100-BQFP
Supplier Device Package: 100-PQFP (14x20)

패키지: 100-BQFP

재고5,216

XC95288XL-10BG256C

Xilinx Inc.

IC CPLD 288MC 10NS 256BGA

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 16
Number of Macrocells: 288
Number of Gates: 6400
Number of I/O: 192
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Supplier Device Package: 256-PBGA (27x27)

패키지: 256-BBGA

재고9,540

XCVU440-2FLGB2377I

Xilinx Inc.

IC FPGA 1248 I/O 2377BGA

Number of LABs/CLBs: 316620
Number of Logic Elements/Cells: 5540850
Total RAM Bits: 90726400
Number of I/O: 1300
Number of Gates: -
Voltage - Supply: 0.922 V ~ 0.979 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2377-BBGA, FCBGA
Supplier Device Package: 2377-FCBGA (50x50)

패키지: 2377-BBGA, FCBGA

재고4,000