페이지 2 - Xilinx Inc. 제품 - 임베디드 - FPGA (Field Programmable Gate Array) | Heisener Electronics
고객 문의
SalesDept@heisener.com +86-755-83210559 ext. 815
로그인/등록
Language Translation

* Please refer to the English Version as our Official Version.

BOM
카트 0

Xilinx Inc. 제품 - 임베디드 - FPGA (Field Programmable Gate Array)

기록 5,652
페이지  2/202
이미지
부품 번호
제조업체
설명
패키지
재고
수량
Number of Logic Elements/Cells
Total RAM Bits
Number of I/O
Number of Gates
Voltage - Supply
Mounting Type
Operating Temperature
Package / Case
Supplier Device Package
XCKU5P-3FFVD900E
Xilinx Inc.

XCKU5P-3FFVD900E

  • Number of LABs/CLBs: 20340
  • Number of Logic Elements/Cells: 355950
  • Total RAM Bits: 31641600
  • Number of I/O: 304
  • Number of Gates: -
  • Voltage - Supply: 0.873 V ~ 0.927 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
패키지: 900-BBGA, FCBGA
재고5,040
355950
31641600
304
-
0.873 V ~ 0.927 V
Surface Mount
0°C ~ 100°C (TJ)
900-BBGA, FCBGA
900-FCBGA (31x31)
XCKU11P-1FFVD900I
Xilinx Inc.

XCKU11P-1FFVD900I

  • Number of LABs/CLBs: 37320
  • Number of Logic Elements/Cells: 653100
  • Total RAM Bits: 53964800
  • Number of I/O: 408
  • Number of Gates: -
  • Voltage - Supply: 0.825 V ~ 0.876 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
패키지: 900-BBGA, FCBGA
재고4,400
653100
53964800
408
-
0.825 V ~ 0.876 V
Surface Mount
-40°C ~ 100°C (TJ)
900-BBGA, FCBGA
900-FCBGA (31x31)
XCKU11P-1FFVA1156E
Xilinx Inc.

XCKU11P-1FFVA1156E

  • Number of LABs/CLBs: 37320
  • Number of Logic Elements/Cells: 653100
  • Total RAM Bits: 53964800
  • Number of I/O: 464
  • Number of Gates: -
  • Voltage - Supply: 0.825 V ~ 0.876 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
패키지: 1156-BBGA, FCBGA
재고5,328
653100
53964800
464
-
0.825 V ~ 0.876 V
Surface Mount
0°C ~ 100°C (TJ)
1156-BBGA, FCBGA
1156-FCBGA (35x35)
XCKU5P-L2FFVD900E
Xilinx Inc.

XCKU5P-L2FFVD900E

  • Number of LABs/CLBs: 27120
  • Number of Logic Elements/Cells: 474600
  • Total RAM Bits: 41984000
  • Number of I/O: 304
  • Number of Gates: -
  • Voltage - Supply: 0.698 V ~ 0.876 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 110°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
패키지: 900-BBGA, FCBGA
재고6,144
474600
41984000
304
-
0.698 V ~ 0.876 V
Surface Mount
0°C ~ 110°C (TJ)
900-BBGA, FCBGA
900-FCBGA (31x31)
XCKU5P-3SFVB784E
Xilinx Inc.

XCKU5P-3SFVB784E

  • Number of LABs/CLBs: 20340
  • Number of Logic Elements/Cells: 355950
  • Total RAM Bits: 31641600
  • Number of I/O: 304
  • Number of Gates: -
  • Voltage - Supply: 0.873 V ~ 0.927 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
패키지: 784-BBGA, FCBGA
재고4,768
355950
31641600
304
-
0.873 V ~ 0.927 V
Surface Mount
0°C ~ 100°C (TJ)
784-BBGA, FCBGA
784-FCBGA (23x23)
XCKU5P-L2FFVB676E
Xilinx Inc.

XCKU5P-L2FFVB676E

  • Number of LABs/CLBs: 27120
  • Number of Logic Elements/Cells: 474600
  • Total RAM Bits: 41984000
  • Number of I/O: 280
  • Number of Gates: -
  • Voltage - Supply: 0.698 V ~ 0.876 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 110°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
패키지: 676-BBGA, FCBGA
재고5,136
474600
41984000
280
-
0.698 V ~ 0.876 V
Surface Mount
0°C ~ 110°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
XCKU5P-L2FFVA676E
Xilinx Inc.

XCKU5P-L2FFVA676E

  • Number of LABs/CLBs: 27120
  • Number of Logic Elements/Cells: 474600
  • Total RAM Bits: 41984000
  • Number of I/O: 256
  • Number of Gates: -
  • Voltage - Supply: 0.698 V ~ 0.876 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 110°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
패키지: 676-BBGA, FCBGA
재고7,040
474600
41984000
256
-
0.698 V ~ 0.876 V
Surface Mount
0°C ~ 110°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
XCKU11P-1FFVD900E
Xilinx Inc.

XCKU11P-1FFVD900E

  • Number of LABs/CLBs: 37320
  • Number of Logic Elements/Cells: 653100
  • Total RAM Bits: 53964800
  • Number of I/O: 408
  • Number of Gates: -
  • Voltage - Supply: 0.825 V ~ 0.876 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
패키지: 900-BBGA, FCBGA
재고3,184
653100
53964800
408
-
0.825 V ~ 0.876 V
Surface Mount
0°C ~ 100°C (TJ)
900-BBGA, FCBGA
900-FCBGA (31x31)
XCKU5P-L2SFVB784E
Xilinx Inc.

XCKU5P-L2SFVB784E

  • Number of LABs/CLBs: 27120
  • Number of Logic Elements/Cells: 474600
  • Total RAM Bits: 41984000
  • Number of I/O: 304
  • Number of Gates: -
  • Voltage - Supply: 0.698 V ~ 0.876 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 110°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
패키지: 784-BBGA, FCBGA
재고3,600
474600
41984000
304
-
0.698 V ~ 0.876 V
Surface Mount
0°C ~ 110°C (TJ)
784-BBGA, FCBGA
784-FCBGA (23x23)
XCKU5P-L1FFVD900I
Xilinx Inc.

XCKU5P-L1FFVD900I

  • Number of LABs/CLBs: 27120
  • Number of Logic Elements/Cells: 474600
  • Total RAM Bits: 41984000
  • Number of I/O: 304
  • Number of Gates: -
  • Voltage - Supply: 0.698 V ~ 0.876 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
패키지: 900-BBGA, FCBGA
재고4,944
474600
41984000
304
-
0.698 V ~ 0.876 V
Surface Mount
-40°C ~ 100°C (TJ)
900-BBGA, FCBGA
900-FCBGA (31x31)
XCKU3P-3FFVD900E
Xilinx Inc.

XCKU3P-3FFVD900E

  • Number of LABs/CLBs: 20340
  • Number of Logic Elements/Cells: 355950
  • Total RAM Bits: 31641600
  • Number of I/O: 304
  • Number of Gates: -
  • Voltage - Supply: 0.873 V ~ 0.927 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
패키지: 900-BBGA, FCBGA
재고5,232
355950
31641600
304
-
0.873 V ~ 0.927 V
Surface Mount
0°C ~ 100°C (TJ)
900-BBGA, FCBGA
900-FCBGA (31x31)
XCKU3P-3FFVB676E
Xilinx Inc.

XCKU3P-3FFVB676E

  • Number of LABs/CLBs: 20340
  • Number of Logic Elements/Cells: 355950
  • Total RAM Bits: 31641600
  • Number of I/O: 280
  • Number of Gates: -
  • Voltage - Supply: 0.873 V ~ 0.927 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
패키지: 676-BBGA, FCBGA
재고7,968
355950
31641600
280
-
0.873 V ~ 0.927 V
Surface Mount
0°C ~ 100°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
XCKU5P-L1SFVB784I
Xilinx Inc.

XCKU5P-L1SFVB784I

  • Number of LABs/CLBs: 27120
  • Number of Logic Elements/Cells: 474600
  • Total RAM Bits: 41984000
  • Number of I/O: 304
  • Number of Gates: -
  • Voltage - Supply: 0.698 V ~ 0.876 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
패키지: 784-BBGA, FCBGA
재고4,800
474600
41984000
304
-
0.698 V ~ 0.876 V
Surface Mount
-40°C ~ 100°C (TJ)
784-BBGA, FCBGA
784-FCBGA (23x23)
XCKU3P-3FFVA676E
Xilinx Inc.

XCKU3P-3FFVA676E

  • Number of LABs/CLBs: 20340
  • Number of Logic Elements/Cells: 355950
  • Total RAM Bits: 31641600
  • Number of I/O: 256
  • Number of Gates: -
  • Voltage - Supply: 0.873 V ~ 0.927 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
패키지: 676-BBGA, FCBGA
재고2,704
355950
31641600
256
-
0.873 V ~ 0.927 V
Surface Mount
0°C ~ 100°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
XCKU3P-L2FFVB676E
Xilinx Inc.

XCKU3P-L2FFVB676E

  • Number of LABs/CLBs: 20340
  • Number of Logic Elements/Cells: 355950
  • Total RAM Bits: 31641600
  • Number of I/O: 280
  • Number of Gates: -
  • Voltage - Supply: 0.698 V ~ 0.876 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
패키지: 676-BBGA, FCBGA
재고5,424
355950
31641600
280
-
0.698 V ~ 0.876 V
Surface Mount
0°C ~ 100°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
XCKU3P-3SFVB784E
Xilinx Inc.

XCKU3P-3SFVB784E

  • Number of LABs/CLBs: 20340
  • Number of Logic Elements/Cells: 355950
  • Total RAM Bits: 31641600
  • Number of I/O: 304
  • Number of Gates: -
  • Voltage - Supply: 0.873 V ~ 0.927 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
패키지: 784-BBGA, FCBGA
재고5,888
355950
31641600
304
-
0.873 V ~ 0.927 V
Surface Mount
0°C ~ 100°C (TJ)
784-BBGA, FCBGA
784-FCBGA (23x23)
XCKU3P-L2FFVD900E
Xilinx Inc.

XCKU3P-L2FFVD900E

  • Number of LABs/CLBs: 20340
  • Number of Logic Elements/Cells: 355950
  • Total RAM Bits: 31641600
  • Number of I/O: 304
  • Number of Gates: -
  • Voltage - Supply: 0.698 V ~ 0.876 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
패키지: 900-BBGA, FCBGA
재고3,680
355950
31641600
304
-
0.698 V ~ 0.876 V
Surface Mount
0°C ~ 100°C (TJ)
900-BBGA, FCBGA
900-FCBGA (31x31)
XC7K355T-1FF901C
Xilinx Inc.

IC FPGA 300 I/O 901FCBGA

  • Number of LABs/CLBs: 27825
  • Number of Logic Elements/Cells: 356160
  • Total RAM Bits: 26357760
  • Number of I/O: 300
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 901-FCBGA (31x31)
패키지: 900-BBGA, FCBGA
재고3,824
356160
26357760
300
-
0.97 V ~ 1.03 V
Surface Mount
0°C ~ 85°C
900-BBGA, FCBGA
901-FCBGA (31x31)
XCKU3P-L2FFVA676E
Xilinx Inc.

XCKU3P-L2FFVA676E

  • Number of LABs/CLBs: 20340
  • Number of Logic Elements/Cells: 355950
  • Total RAM Bits: 31641600
  • Number of I/O: 256
  • Number of Gates: -
  • Voltage - Supply: 0.698 V ~ 0.876 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
패키지: 676-BBGA, FCBGA
재고5,888
355950
31641600
256
-
0.698 V ~ 0.876 V
Surface Mount
0°C ~ 100°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
XCKU3P-L2SFVB784E
Xilinx Inc.

XCKU3P-L2SFVB784E

  • Number of LABs/CLBs: 20340
  • Number of Logic Elements/Cells: 355950
  • Total RAM Bits: 31641600
  • Number of I/O: 256
  • Number of Gates: -
  • Voltage - Supply: 0.698 V ~ 0.876 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
패키지: 784-BBGA, FCBGA
재고7,248
355950
31641600
256
-
0.698 V ~ 0.876 V
Surface Mount
0°C ~ 100°C (TJ)
784-BBGA, FCBGA
784-FCBGA (23x23)
XCKU3P-L1FFVD900I
Xilinx Inc.

XCKU3P-L1FFVD900I

  • Number of LABs/CLBs: 20340
  • Number of Logic Elements/Cells: 355950
  • Total RAM Bits: 31641600
  • Number of I/O: 304
  • Number of Gates: -
  • Voltage - Supply: 0.698 V ~ 0.876 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
패키지: 900-BBGA, FCBGA
재고7,952
355950
31641600
304
-
0.698 V ~ 0.876 V
Surface Mount
-40°C ~ 100°C (TJ)
900-BBGA, FCBGA
900-FCBGA (31x31)
XCKU3P-L1FFVB676I
Xilinx Inc.

XCKU3P-L1FFVB676I

  • Number of LABs/CLBs: 20340
  • Number of Logic Elements/Cells: 355950
  • Total RAM Bits: 31641600
  • Number of I/O: 280
  • Number of Gates: -
  • Voltage - Supply: 0.698 V ~ 0.876 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
패키지: 676-BBGA, FCBGA
재고2,336
355950
31641600
280
-
0.698 V ~ 0.876 V
Surface Mount
-40°C ~ 100°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
XCKU3P-L1FFVA676I
Xilinx Inc.

XCKU3P-L1FFVA676I

  • Number of LABs/CLBs: 20340
  • Number of Logic Elements/Cells: 355950
  • Total RAM Bits: 31641600
  • Number of I/O: 256
  • Number of Gates: -
  • Voltage - Supply: 0.698 V ~ 0.876 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
패키지: 676-BBGA, FCBGA
재고2,048
355950
31641600
256
-
0.698 V ~ 0.876 V
Surface Mount
-40°C ~ 100°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
XCKU3P-L1SFVB784I
Xilinx Inc.

XCKU3P-L1SFVB784I

  • Number of LABs/CLBs: 20340
  • Number of Logic Elements/Cells: 355950
  • Total RAM Bits: 31641600
  • Number of I/O: 256
  • Number of Gates: -
  • Voltage - Supply: 0.698 V ~ 0.876 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
패키지: 784-BBGA, FCBGA
재고3,872
355950
31641600
256
-
0.698 V ~ 0.876 V
Surface Mount
-40°C ~ 100°C (TJ)
784-BBGA, FCBGA
784-FCBGA (23x23)
XCKU035-L1SFVA784I
Xilinx Inc.

IC FPGA

  • Number of LABs/CLBs: 25391
  • Number of Logic Elements/Cells: 444343
  • Total RAM Bits: 19456000
  • Number of I/O: 468
  • Number of Gates: -
  • Voltage - Supply: 0.880 V ~ 0.979 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCCSPBGA (23x23)
패키지: 784-BBGA, FCBGA
재고2,352
444343
19456000
468
-
0.880 V ~ 0.979 V
Surface Mount
-40°C ~ 100°C (TJ)
784-BBGA, FCBGA
784-FCCSPBGA (23x23)
XCDAISY-FF1924
Xilinx Inc.

XCDAISY-FF1924

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
재고5,936
-
-
-
-
-
-
-
-
-
XCDAISY-FF1738
Xilinx Inc.

CONNECT EBOM

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
재고7,920
-
-
-
-
-
-
-
-
-
XC2VP30-5FG676C
Xilinx Inc.

IC FPGA 30816 CLB 676BGA

  • Number of LABs/CLBs: 3424
  • Number of Logic Elements/Cells: 30816
  • Total RAM Bits: 2506752
  • Number of I/O: 416
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
패키지: 676-BGA
재고5,200
30816
2506752
416
-
1.425 V ~ 1.575 V
Surface Mount
0°C ~ 85°C (TJ)
676-BGA
676-FBGA (27x27)