Molex Connector Corporation 제품 - IC용 소켓, 트랜지스터

이미지	부품 번호	제조업체	설명	패키지	재고	수량	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	50-39-5288	Molex Connector Corporation	CONN IC DIP SOCKET 28POS TINLEAD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: Through Hole Features: Closed Frame Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	패키지: -	재고4,050		28 (2 x 14)	0.100" (2.54mm)	Tin-Lead	-	-	Through Hole	Closed Frame	-	-	-	-	-	-	-
	10-18-2031	Molex Connector Corporation	CONN SOCKET TRANSIST TO-220 3POS Type: Transistor, TO-220 Number of Positions or Pins (Grid): 3 (Rectangular) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Brass Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 100µin (2.54µm) Contact Material - Post: Brass Housing Material: Polyester, Glass Filled Operating Temperature: -	패키지: -	재고3,598		3 (Rectangular)	0.100" (2.54mm)	Tin	-	Brass	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	100µin (2.54µm)	Brass	Polyester, Glass Filled	-