이미지 |
부품 번호 |
제조업체 |
설명 |
패키지 |
재고 |
수량 |
Input Type | Output Type | Interface | Current - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
IC IMAGE SENSOR
|
패키지: - |
재고6,928 |
|
Logic | Logic | - | 2mA | -20°C ~ 45°C | - | - | - |
|
|
ON Semiconductor |
IC TACH/SPEEDO DRIVER 16-DIP
|
패키지: 16-DIP (0.300", 7.62mm) |
재고5,760 |
|
Voltage | Differential | - | 125mA | -40°C ~ 105°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-DIP |
|
|
Intersil |
IC SENSOR CONDITION UNIV 14TSSOP
|
패키지: 14-TSSOP (0.173", 4.40mm Width) |
재고5,408 |
|
Voltage | Voltage | 2-Wire | 15mA | -40°C ~ 100°C | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |
|
|
|
Texas Instruments |
IC V TO I CONVERTER/XMTR 16 DIP
|
패키지: 16-DIP (0.300", 7.62mm) |
재고6,720 |
|
Voltage | Current | - | 20mA | 0°C ~ 70°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-PDIP |
|
|
Analog Devices Inc. |
IC THERMOCOUPLE A W/COMP 8MSOP
|
패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
재고4,192 |
|
Differential | Analog | - | 250µA | 25°C ~ 100°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
|
|
Microchip Technology |
IC SENSOR FUSION MOVEA 84TFBGA
|
패키지: 84-TFBGA |
재고6,352 |
|
- | - | I2C | - | - | Surface Mount | 84-TFBGA | 84-TFBGA (6x6) |
|
|
Maxim Integrated |
IC TRANSLATOR/SERIALIZER 28TSSOP
|
패키지: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad |
재고4,160 |
|
Analog | Digital | SPI | 1.4mA | -40°C ~ 125°C | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) Exposed Pad | 28-TSSOP |
|
|
|
Texas Instruments |
IC SENSOR SIGNAL COND 36DSBGA
|
패키지: 36-UFBGA, DSBGA |
재고7,136 |
|
- | - | 1-Wire?, SPI | 13.6mA | -40°C ~ 125°C | Surface Mount | 36-UFBGA, DSBGA | 36-DSBGA |
|
|
Texas Instruments |
IC FDC CAPTIVE SENSING 16WQFN
|
패키지: 16-WFQFN Exposed Pad |
재고5,616 |
|
Capacitive | I2C | - | 2.1mA | -40°C ~ 125°C | Surface Mount | 16-WFQFN Exposed Pad | 16-WQFN (4x4) |
|
|
Texas Instruments |
IC SENSOR SIGNAL COND 20VQFN
|
패키지: 20-VQFN Exposed Pad |
재고205,224 |
|
Logic | Logic | - | 6.8mA | -40°C ~ 125°C | Surface Mount | 20-VQFN Exposed Pad | 20-VQFN (5x5) |
|
|
Maxim Integrated |
IC HALL EFFECT SENSOR 10UMAX
|
패키지: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
재고6,832 |
|
Logic | Analog, Digital | 2-Wire | 1mA | -40°C ~ 125°C | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-uMAX |
|
|
Microchip Technology |
IC PROXIMITY DETECTOR 8SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고4,256 |
|
- | - | I2C | - | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
|
|
|
Microchip Technology |
IC HORN DRIVER DUAL 8SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고7,360 |
|
Logic | Logic | Logic | 100nA | 0°C ~ 50°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
|
|
Maxim Integrated |
IC CONV THRMCPLE-DIG N TYPE TDFN
|
패키지: 10-WFDFN Exposed Pad |
재고5,680 |
|
Thermocouple (Multiple) | Digital | 1-Wire? | 900µA | -40°C ~ 125°C | Surface Mount | 10-WFDFN Exposed Pad | 10-TDFN-EP (3x4) |
|
|
Analog Devices Inc. |
IC SIGNAL COND STRAIN GAUGE 28DI
|
패키지: 28-DIP (0.600", 15.24mm) |
재고6,800 |
|
Voltage | Voltage | - | 10mA | -40°C ~ 85°C | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
|
|
Maxim Integrated |
IC TIME-TO-DGTL CONV W/AFE TQFP
|
패키지: 32-TQFP Exposed Pad |
재고6,384 |
|
CMOS | CMOS | Serial | - | -40°C ~ 85°C | Surface Mount | 32-TQFP Exposed Pad | 32-TQFP (5x5) |
|
|
Analog Devices Inc. |
IC DSP CTLR 16BIT 28SSOP
|
패키지: 28-SSOP (0.209", 5.30mm Width) |
재고144,000 |
|
Analog | Digital | Serial | 95mA | 0°C ~ 70°C | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP |
|
|
Texas Instruments |
IC 4-20 MA I-TRANSMITTER 14-DIP
|
패키지: 14-DIP (0.300", 7.62mm) |
재고6,048 |
|
Differential | Voltage | 3-Wire | 20mA | -40°C ~ 85°C | Through Hole | 14-DIP (0.300", 7.62mm) | 14-PDIP |
|
|
Maxim Integrated |
IC SENSOR INTERFACE VARI 16-QSOP
|
패키지: 16-SSOP (0.154", 3.90mm Width) |
재고5,808 |
|
Differential | Logic | Differential | 10mA | -40°C ~ 125°C | Surface Mount | 16-SSOP (0.154", 3.90mm Width) | 16-QSOP |
|
|
Melexis Technologies NV |
AUTOMOTIVE SENSOR INTERFACE
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고2,384 |
|
Differential | - | - | 8mA | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
|
|
|
Renesas Electronics Corporation |
PQFN / 24 / 4X4MM G1 - TAPE&REE
|
패키지: - |
Request a Quote |
|
Analog | 1-Wire®, I2C, SPI | - | 2.8 mA | -40°C ~ 125°C (TA) | Surface Mount | 24-VFQFN Exposed Pad | 24-VFQFPN (4x4) |
|
|
|
onsemi |
DUAL INDUCTIVE ROTARY POSITION S
|
패키지: - |
재고14,970 |
|
Analog, Digital | Serial, SPI | - | 133 mA | -40°C ~ 85°C (TA) | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
|
|
|
Renesas Electronics Corporation |
AUTOMOTIVE SENSOR SIGNAL CONDITI
|
패키지: - |
재고15,000 |
|
- | 1-Wire®, I2C | - | - | -40°C ~ 150°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
|
|
|
ScioSense |
AS6031-BQFM QFN48 LF T&RDP
|
패키지: - |
Request a Quote |
|
Digital | SPI | - | 80 µA | -40°C ~ 85°C (TA) | - | - | - |
|
|
|
Analog Devices Inc./Maxim Integrated |
24V 100MA PIN-CONFIGURABLE INDUS
|
패키지: - |
Request a Quote |
|
Logic | - | - | 1.2 mA | -40°C ~ 105°C (TA) | Surface Mount | 12-WFBGA, WLBGA | 12-WLP (2.14x1.56) |
|
|
|
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
패키지: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
|
|
|
Renesas Electronics Corporation |
PQFN / 24 / 4X4MM G1 - TAPE&REEL
|
패키지: - |
Request a Quote |
|
Analog, Digital | 1-Wire®, I2C, SPI | - | 18 mA | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
|
|
|
Renesas Electronics Corporation |
DICE (WAFER SAWN) - WAFFLE PACK
|
패키지: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
|
|
|
Analog Devices Inc. |
MULTI-MODAL OPTICAL AFE, I2C
|
패키지: - |
재고4,440 |
|
Analog, Digital | I2C, SPI | - | 10 µA | -40°C ~ 85°C (TA) | Surface Mount | 33-UFBGA, WLCSP | 33-WLCSP (3.11x2.14) |
|
|
|
Renesas Electronics Corporation |
DICE (WAFER SAWN) - WAFFLE PACK
|
패키지: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
