Renesas Electronics has developed for 5G and broadband wireless applications, providing first-class performance in the N257, N258 and 261 bands. Expanded its 5G beamforming IC series and introduced two new dual-polarized millimeter-wave devices optimized for the 2X2 antenna architecture. The highly integrated F5288 and F5268 Transmitter/receiver (8T8R) chipset comes in a small 5.1mm x 5.1mm BGA package and offers what is claimed to be the industry's highest silicon Tx output power capability - providing over 15.5dBm of linear output power per channel. Through this combination, the company promotes cost-effective radio designs that provide a wide range of signals for wireless infrastructure applications, including wide-area, small cellular and acer stations, as well as CPE, FWA access points and a variety of other applications.
The new integrated circuit allows efficient operation at programmable linear output power levels from 10dBm to 16dBm, a unique dynamic array power (DAP) technology. This flexibility enables communications customers to reduce design time by reusing their antenna array designs on different applications. This makes the third generation IC ideal for mobile and fixed wireless applications with a wide range of output power requirements.
"As the industry shifts to 5G millimeter wave technology for urban and suburban mobile and fixed wireless networks, sufficient signal range -- or lack of it -- remains the biggest challenge," said Naveen Yanduru, vice president of Renesas RF Communications Products. Renesas's new beamforming chip is a game changer in this evolving market, providing a small, integrated beamforming solution with high power output that enables communications customers to implement low-cost base station and FWA designs for remote wireless applications."
DAP technology provides an elegant output power scaling and high efficiency. The IC also incorporates various advanced renesas technologies to improve array-level performance. RapidBeam's advanced digital control technology facilitates synchronous and asynchronous control of multiple beamforming chips, providing very fast beam steering operations. ArraySense technology has an extensive on-chip sensor network that enables users to monitor IC performance during array operations and achieve critical corrections in real time.
