Maxim Integrated 제품 - 인터페이스 - 모뎀 - IC 및 모듈

부품 번호	제조업체	설명	패키지	재고	Baud Rates	Voltage - Supply	Mounting Type	Package / Case	Supplier Device Package
73M2901CE-IGVR/F	Maxim Integrated	IC MODEM 3.3V V.22BIS 32-TQFP Data Format: V.21, V.22, V.23, Bell 103, Bell 212A Baud Rates: 300 ~ 9.6k Voltage - Supply: 2.7 V ~ 3.6 V Mounting Type: Surface Mount Package / Case: 32-TQFP Supplier Device Package: 32-TQFP (7x7)	패키지: 32-TQFP	재고7,520	300 ~ 9.6k	2.7 V ~ 3.6 V	Surface Mount	32-TQFP	32-TQFP (7x7)
73M2901CE-IMR/F	Maxim Integrated	IC MODEM 3.3V V.22BIS 32-QFN Data Format: V.21, V.22, V.23, Bell 103, Bell 212A Baud Rates: 300 ~ 9.6k Voltage - Supply: 2.7 V ~ 3.6 V Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN (5x5)	패키지: 32-VFQFN Exposed Pad	재고5,856	300 ~ 9.6k	2.7 V ~ 3.6 V	Surface Mount	32-VFQFN Exposed Pad	32-QFN (5x5)
73M2901CE-IM/F	Maxim Integrated	IC MODEM 3.3V V.22BIS 32-QFN Data Format: V.21, V.22, V.23, Bell 103, Bell 212A Baud Rates: 300 ~ 9.6k Voltage - Supply: 2.7 V ~ 3.6 V Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN (5x5)	패키지: 32-VFQFN Exposed Pad	재고4,480	300 ~ 9.6k	2.7 V ~ 3.6 V	Surface Mount	32-VFQFN Exposed Pad	32-QFN (5x5)
73M2901CE-IGV/F	Maxim Integrated	IC MODEM 3.3V V.22BIS 32-TQFP Data Format: V.21, V.22, V.23, Bell 103, Bell 212A Baud Rates: 300 ~ 9.6k Voltage - Supply: 2.7 V ~ 3.6 V Mounting Type: Surface Mount Package / Case: 32-TQFP Supplier Device Package: 32-TQFP	패키지: 32-TQFP	재고6,960	300 ~ 9.6k	2.7 V ~ 3.6 V	Surface Mount	32-TQFP	32-TQFP